Configuration of a memory device for programming memory cells

ABSTRACT

Memories having a controller configured to perform methods during programming operations including apply a first voltage level to a data line selectively connected to a selected memory cell selected, apply a lower second voltage level to a select gate connected between the data line and the memory cell, decrease the voltage level applied to the data line from the first voltage level to a third voltage level while continuing to apply the second voltage level to the select gate, increase the voltage level applied to the select gate from the second voltage level to a fourth voltage level after the voltage level of the data line settles to the third voltage level, and apply a programming voltage to the memory cell after increasing the voltage level applied to the select gate to the fourth voltage level.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.17/012,442, filed Sep. 4, 2020, which is a continuation of U.S.application Ser. No. 16/655,826, titled “CONFIGURATION OF A MEMORYDEVICE FOR PROGRAMMING MEMORY CELLS,” filed Oct. 17, 2019, (allowed),issued as U.S. Pat. No. 10,777,277 on Sep. 15, 2020, which isContinuation of U.S. application Ser. No. 16/106,185, titled “OPERATIONOF A MEMORY DEVICE DURING PROGRAMMING,” filed Aug. 21, 2018, issued asU.S. Pat. No. 10,482,974 on Nov. 19, 2019, which are commonly assignedand incorporated herein by reference.

TECHNICAL FIELD

The present disclosure relates generally to memory and, in particular,in one or more embodiments, the present disclosure relates to operationof a memory device during programming.

BACKGROUND

Memory devices are typically provided as internal, semiconductor,integrated circuit devices in computers or other electronic devices.There are many different types of memory including random-access memory(RAM), read only memory (ROM), dynamic random access memory (DRAM),synchronous dynamic random access memory (SDRAM), and flash memory.

Flash memory has developed into a popular source of non-volatile memoryfor a wide range of electronic applications. Flash memory typically usea one-transistor memory cell that allows for high memory densities, highreliability, and low power consumption. Changes in threshold voltage(Vt) of the memory cells, through programming (which is often referredto as writing) of charge storage structures (e.g., floating gates orcharge traps) or other physical phenomena (e.g., phase change orpolarization), determine the data state (e.g., data value) of eachmemory cell. Common uses for flash memory and other non-volatile memoryinclude personal computers, personal digital assistants (PDAs), digitalcameras, digital media players, digital recorders, games, appliances,vehicles, wireless devices, mobile telephones, and removable memorymodules, and the uses for non-volatile memory continue to expand.

A NAND flash memory is a common type of flash memory device, so calledfor the logical form in which the basic memory cell configuration isarranged. Typically, the array of memory cells for NAND flash memory isarranged such that the control gate of each memory cell of a row of thearray is connected together to form an access line, such as a word line.Columns of the array include strings (often termed NAND strings) ofmemory cells connected together in series between a pair of selectgates, e.g., a source select transistor and a drain select transistor.Each source select transistor may be connected to a source, while eachdrain select transistor may be connected to a data line, such as columnbit line. Variations using more than one select gate between a string ofmemory cells and the source, and/or between the string of memory cellsand the data line, are known.

Programming memory typically utilizes an iterative process of applying aprogramming pulse to a memory cell and verifying if that memory cell hasreached its desired data state in response to that programming pulse,and repeating that iterative process until that memory cell passes theverification. Once a memory cell passes the verification, it may beinhibited from further programming, although other memory cells maystill be enabled for programming for subsequent programming pulses. Theiterative process can be repeated with changing (e.g., increasing)voltage levels of the programming pulse until each memory cell selectedfor the programming operation has reached its respective desired datastate, or some failure is declared, e.g., reaching a maximum number ofallowed programming pulses during the programming operation.

While programming a selected memory cell of one NAND string, a memorycell of an adjacent NAND string might be inhibited from programming.This typically involves boosting a voltage level of a channel region ofthe adjacent NAND string such that a programming voltage applied to itsmemory cell produces a voltage differential across its gate stack thatis insufficient to appreciably change the threshold voltage of thatmemory cell. Where the boosting of the channel voltage is insufficient,unintended changes in the threshold voltage of the inhibited memory cellmight occur. This is a condition known generally as program disturb.

To meet the demand for higher capacity memories, designers continue tostrive for increasing memory density, i.e., the number of memory cellsfor a given area of an integrated circuit die. One way to increasememory density is to form NAND strings vertically along semiconductorpillars, which can act as channel regions of the NAND strings. However,such NAND string architecture may result in higher resistance levels fora channel region, thus making it more difficult to boost the voltagelevel of the channel region prior to applying a programming pulse.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a simplified block diagram of a memory in communication with aprocessor as part of an electronic system, according to an embodiment.

FIGS. 2A-2B are schematics of portions of an array of memory cells ascould be used in a memory of the type described with reference to FIG. 1.

FIG. 2C is a conceptual depiction of a portion of an array of memorycells as could be used in a memory of the type described with referenceto FIG. 1 .

FIG. 3 depicts a waveform for a programming operation of related art.

FIG. 4 depicts a waveform for a programming operation in accordance withan embodiment.

FIG. 5 is a flowchart of a method of operating a memory according to anembodiment.

FIG. 6 is a flowchart of a method of operating a memory according toanother embodiment.

DETAILED DESCRIPTION

In the following detailed description, reference is made to theaccompanying drawings that form a part hereof, and in which is shown, byway of illustration, specific embodiments. In the drawings, likereference numerals describe substantially similar components throughoutthe several views. Other embodiments may be utilized and structural,logical and electrical changes may be made without departing from thescope of the present disclosure. The following detailed description is,therefore, not to be taken in a limiting sense.

The term “semiconductor” used herein can refer to, for example, a layerof material, a wafer, or a substrate, and includes any basesemiconductor structure. “Semiconductor” is to be understood asincluding silicon on sapphire (SOS) technology, silicon on insulator(SOI) technology, thin film transistor (TFT) technology, doped andundoped semiconductors, epitaxial layers of a silicon supported by abase semiconductor structure, as well as other semiconductor structureswell known to one skilled in the art. Furthermore, when reference ismade to a semiconductor in the following description, previous processsteps may have been utilized to form regions/junctions in the basesemiconductor structure, and the term semiconductor can include theunderlying layers containing such regions/junctions. The term conductiveas used herein, as well as its various related forms, e.g., conduct,conductively, conducting, conduction, conductivity, etc., refers toelectrically conductive unless otherwise apparent from the context.Similarly, the term connecting as used herein, as well as its variousrelated forms, e.g., connect, connected, connection, etc., refers toelectrically connecting unless otherwise apparent from the context.

FIG. 1 is a simplified block diagram of a first apparatus, in the formof a memory (e.g., memory device) 100, in communication with a secondapparatus, in the form of a processor 130, as part of a third apparatus,in the form of an electronic system, according to an embodiment. Someexamples of electronic systems include personal computers, personaldigital assistants (PDAs), digital cameras, digital media players,digital recorders, games, appliances, vehicles, wireless devices,cellular telephones and the like. The processor 130, e.g., a controllerexternal to the memory device 100, may be a memory controller or otherexternal host device.

Memory device 100 includes an array of memory cells 104 logicallyarranged in rows and columns. Memory cells of a logical row aretypically connected to the same access line (commonly referred to as aword line) while memory cells of a logical column are typicallyselectively connected to the same data line (commonly referred to as abit line). A single access line may be associated with more than onelogical row of memory cells and a single data line may be associatedwith more than one logical column. Memory cells (not shown in FIG. 1 )of at least a portion of array of memory cells 104 are capable of beingprogrammed to one of at least two data states.

A row decode circuitry 108 and a column decode circuitry 110 areprovided to decode address signals. Address signals are received anddecoded to access the array of memory cells 104. Memory device 100 alsoincludes input/output (I/O) control circuitry 112 to manage input ofcommands, addresses and data to the memory device 100 as well as outputof data and status information from the memory device 100. An addressregister 114 is in communication with I/O control circuitry 112 and rowdecode circuitry 108 and column decode circuitry 110 to latch theaddress signals prior to decoding. A command register 124 is incommunication with I/O control circuitry 112 and control logic 116 tolatch incoming commands.

A controller (e.g., the control logic 116 internal to the memory device100) controls access to the array of memory cells 104 in response to thecommands and generates status information for the external processor130, i.e., control logic 116 is configured to perform access operations(e.g., read operations, programming operations and/or erase operations)in accordance with embodiments described herein. The control logic 116is in communication with row decode circuitry 108 and column decodecircuitry 110 to control the row decode circuitry 108 and column decodecircuitry 110 in response to the addresses.

Control logic 116 is also in communication with a cache register 118.Cache register 118 latches data, either incoming or outgoing, asdirected by control logic 116 to temporarily store data while the arrayof memory cells 104 is busy writing or reading, respectively, otherdata. During a programming operation (e.g., write operation), data maybe passed from the cache register 118 to the data register 120 fortransfer to the array of memory cells 104; then new data may be latchedin the cache register 118 from the I/O control circuitry 112. During aread operation, data may be passed from the cache register 118 to theI/O control circuitry 112 for output to the external processor 130; thennew data may be passed from the data register 120 to the cache register118. A status register 122 may be in communication with I/O controlcircuitry 112 and control logic 116 to latch the status information foroutput to the processor 130.

Memory device 100 receives control signals at control logic 116 fromprocessor 130 over a control link 132. The control signals might includea chip enable CE #, a command latch enable CLE, an address latch enableALE, a write enable WE #, a read enable RE #, and a write protect WP #.Additional or alternative control signals (not shown) may be furtherreceived over control link 132 depending upon the nature of the memorydevice 100. Memory device 100 receives command signals (which representcommands), address signals (which represent addresses), and data signals(which represent data) from processor 130 over a multiplexedinput/output (I/O) bus 134 and outputs data to processor 130 over I/Obus 134.

For example, the commands my be received over input/output (I/O) pins[7:0] of I/O bus 134 at I/O control circuitry 112 and may then bewritten into command register 124. The addresses may be received overinput/output (I/O) pins [7:0] of I/O bus 134 at I/O control circuitry112 and may then be written into address register 114. The data may bereceived over input/output (I/O) pins [7:0] for an 8-bit device orinput/output (I/O) pins [15:0] for a 16-bit device at I/O controlcircuitry 112 and then may be written into cache register 118. The datamay be subsequently written into data register 120 for programming thearray of memory cells 104. For another embodiment, cache register 118may be omitted, and the data may be written directly into data register120. Data may also be output over input/output (I/O) pins [7:0] for an8-bit device or input/output (I/O) pins [15:0] for a 16-bit device.

It will be appreciated by those skilled in the art that additionalcircuitry and signals can be provided, and that the memory device 100 ofFIG. 1 has been simplified. It should be recognized that thefunctionality of the various block components described with referenceto FIG. 1 may not necessarily be segregated to distinct components orcomponent portions of an integrated circuit device. For example, asingle component or component portion of an integrated circuit devicecould be adapted to perform the functionality of more than one blockcomponent of FIG. 1 . Alternatively, one or more components or componentportions of an integrated circuit device could be combined to performthe functionality of a single block component of FIG. 1 .

Additionally, while specific I/O pins are described in accordance withpopular conventions for receipt and output of the various signals, it isnoted that other combinations or numbers of I/O pins (or other I/O nodestructures) may be used in the various embodiments.

FIG. 2A is a schematic of a portion of an array of memory cells 200A ascould be used in a memory of the type described with reference to FIG. 1, e.g., as a portion of array of memory cells 104. Memory array 200Aincludes access lines, such as word lines 202 ₀ to 202 _(N), and a dataline, such as bit line 204. The word lines 202 may be connected toglobal access lines (e.g., global word lines), not shown in FIG. 2A, ina many-to-one relationship. For some embodiments, memory array 200A maybe formed over a semiconductor that, for example, may be conductivelydoped to have a conductivity type, such as a p-type conductivity, e.g.,to form a p-well, or an n-type conductivity, e.g., to form an n-well.

Memory array 200A might be arranged in rows (each corresponding to aword line 202) and columns (each corresponding to a bit line 204). Eachcolumn may include a string of series-connected memory cells (e.g.,non-volatile memory cells), such as one of NAND strings 206 ₀ to 206_(M). Each NAND string 206 might be connected (e.g., selectivelyconnected) to a common source 216 (SRC) and might include memory cells208 ₀ to 208 _(N). The memory cells 208 may represent non-volatilememory cells for storage of data. The memory cells 208 of each NANDstring 206 might be connected in series between a select gate 210 (e.g.,a field-effect transistor), such as one of the select gates 210 ₀ to 210_(M) (e.g., that may be source select transistors, commonly referred toas select gate source), and a select gate 212 (e.g., a field-effecttransistor), such as one of the select gates 212 ₀ to 212 _(M) (e.g.,that may be drain select transistors, commonly referred to as selectgate drain). Select gates 210 ₀ to 210 _(M) might be commonly connectedto a select line 214, such as a source select line (SGS), and selectgates 212 ₀ to 212 _(M) might be commonly connected to a select line215, such as a drain select line (SGD). Although depicted as traditionalfield-effect transistors, the select gates 210 and 212 may utilize astructure similar to (e.g., the same as) the memory cells 208. Theselect gates 210 and 212 might represent a plurality of select gatesconnected in series, with each select gate in series configured toreceive a same or independent control signal.

A source of each select gate 210 might be connected to common source216. The drain of each select gate 210 might be connected to a memorycell 208 ₀ of the corresponding NAND string 206. For example, the drainof select gate 210 ₀ might be connected to memory cell 208 ₀ of thecorresponding NAND string 206 ₀. Therefore, each select gate 210 mightbe configured to selectively connect a corresponding NAND string 206 tocommon source 216. A control gate of each select gate 210 might beconnected to select line 214.

The drain of each select gate 212 might be connected to the bit line 204for the corresponding NAND string 206. For example, the drain of selectgate 212 ₀ might be connected to the bit line 204 ₀ for thecorresponding NAND string 206 ₀. The source of each select gate 212might be connected to a memory cell 208 _(N) of the corresponding NANDstring 206. For example, the source of select gate 212 ₀ might beconnected to memory cell 208 _(N) of the corresponding NAND string 206₀. Therefore, each select gate 212 might be configured to selectivelyconnect a corresponding NAND string 206 to the common bit line 204. Acontrol gate of each select gate 212 might be connected to select line215.

The memory array in FIG. 2A might be a three-dimensional memory array,e.g., where NAND strings 206 may extend substantially perpendicular to aplane containing the common source 216 and to a plane containing aplurality of bit lines 204 that may be substantially parallel to theplane containing the common source 216.

Typical construction of memory cells 208 includes a data-storagestructure 234 (e.g., a floating gate, charge trap, etc.) that candetermine a data state of the memory cell (e.g., through changes inthreshold voltage), and a control gate 236, as shown in FIG. 2A. Thedata-storage structure 234 may include both conductive and/or dielectricstructures while the control gate 236 is generally formed of one or moreconductive materials. In some cases, memory cells 208 may further have adefined source/drain (e.g., source) 230 and a defined source/drain(e.g., drain) 232. Memory cells 208 have their control gates 236connected to (and in some cases form) a word line 202.

A column of the memory cells 208 may be a NAND string 206 or a pluralityof NAND strings 206 selectively connected to a given bit line 204. A rowof the memory cells 208 may be memory cells 208 commonly connected to agiven word line 202. A row of memory cells 208 can, but need not,include all memory cells 208 commonly connected to a given word line202. Rows of memory cells 208 may often be divided into one or moregroups of physical pages of memory cells 208, and physical pages ofmemory cells 208 often include every other memory cell 208 commonlyconnected to a given word line 202. For example, memory cells 208commonly connected to word line 202 _(N) and selectively connected toeven bit lines 204 (e.g., bit lines 204 ₀, 204 ₂, 204 ₄, etc.) may beone physical page of memory cells 208 (e.g., even memory cells) whilememory cells 208 commonly connected to word line 202 _(N) andselectively connected to odd bit lines 204 (e.g., bit lines 204 ₁, 204₃, 204 ₅, etc.) may be another physical page of memory cells 208 (e.g.,odd memory cells). Although bit lines 204 ₃-204 ₅ are not explicitlydepicted in FIG. 2A, it is apparent from the figure that the bit lines204 of the array of memory cells 200A may be numbered consecutively frombit line 204 ₀ to bit line 204 _(M). Other groupings of memory cells 208commonly connected to a given word line 202 may also define a physicalpage of memory cells 208. For certain memory devices, all memory cellscommonly connected to a given word line might be deemed a physical pageof memory cells. The portion of a physical page of memory cells (which,in some embodiments, could still be the entire row) that is read duringa single read operation or programmed during a single programmingoperation (e.g., an upper or lower page of memory cells) might be deemeda logical page of memory cells. A block of memory cells may includethose memory cells that are configured to be erased together, such asall memory cells connected to word lines 202 ₀-202 _(N) (e.g., all NANDstrings 206 sharing common word lines 202). Unless expresslydistinguished, a reference to a page of memory cells herein refers tothe memory cells of a logical page of memory cells.

FIG. 2B is another schematic of a portion of an array of memory cells200B as could be used in a memory of the type described with referenceto FIG. 1 , e.g., as a portion of array of memory cells 104. Likenumbered elements in FIG. 2B correspond to the description as providedwith respect to FIG. 2A. FIG. 2B provides additional detail of oneexample of a three-dimensional NAND memory array structure. Thethree-dimensional NAND memory array 200B may incorporate verticalstructures which may include semiconductor pillars where a portion of apillar may act as a channel region of the memory cells of NAND strings206. The NAND strings 206 may be each selectively connected to a bitline 204 ₀-204 _(M) by a select transistor 212 (e.g., that may be drainselect transistors, commonly referred to as select gate drain) and to acommon source 216 by a select transistor 210 (e.g., that may be sourceselect transistors, commonly referred to as select gate source).Multiple NAND strings 206 might be selectively connected to the same bitline 204. Subsets of NAND strings 206 can be connected to theirrespective bit lines 204 by biasing the select lines 215 ₀-215 _(L) toselectively activate particular select transistors 212 each between aNAND string 206 and a bit line 204. The select transistors 210 can beactivated by biasing the select line 214. Each word line 202 may beconnected to multiple rows of memory cells of the memory array 200B.Rows of memory cells that are commonly connected to each other by aparticular word line 202 may collectively be referred to as tiers.

FIG. 2C is a conceptual depiction of a portion of an array of memorycells 200C as could be used in a memory of the type described withreference to FIG. 1 . Data Lines 204 ₀ and 204 ₁ of FIG. 2C mightcorrespond to data lines 204 ₀ and 204 ₁ of FIG. 2B. Channel regions(e.g., semiconductor pillars) 238 ₀₀ and 238 ₀₁ might represent thechannel regions of different strings of series-connected memory cells(e.g., NAND strings 206 of FIGS. 2A-2B) selectively connected to thedata line 204 ₀ in response to select lines 215 ₀ and 215 ₁,respectively. Similarly, channel regions 238 ₁₀ and 238 ₁₁ mightrepresent the channel regions of different strings of series-connectedmemory cells (e.g., NAND strings 206 of FIGS. 2A-2B) selectivelyconnected to the data line 204 ₁ in response to select lines 215 ₀ and215 ₁, respectively. The access lines 202 ₀-202 _(N) depicted in FIG. 2Amight be represented in FIG. 2C by the access lines 202 ₀-202 ₇, where Nmight be equal to 7 in this example. While strings of series-connectedmemory cells typically contain much larger numbers of memory cells, FIG.2C has been simplified for discussion. A memory cell (not depicted inFIG. 2C) may be formed at each intersection of an access line 202 and achannel region 238, and the memory cells corresponding to a singlechannel region 238 may collectively form a string of series-connectedmemory cells (e.g., a NAND string of FIGS. 2A-2B). The structuredepicted and described with reference to FIG. 2C will be used todescribe various embodiments herein. Additional features might be commonin such structures, such as dummy access lines, segmented channelregions with interposed conductive regions, etc. However, suchalterations or enhancements to the simplified structure depicted in FIG.2C are not relevant to embodiments described herein.

FIG. 3 depicts waveforms for a programming operation of related art. Asis typical in the related art, a programming operation might include afirst portion used to precharge or seed the channel regions of memorycells of a block of memory cells to a precharge voltage level, a secondportion used to boost the voltage level of the channel regions ofstrings of series-connected memory cells of the block of memory cellsnot intended for programming (e.g., to be inhibited) to a voltage levelsufficient to inhibit programming of any memory cell of those strings ofseries-connected memory cells receiving a programming voltage, and athird portion used for programming one or more selected memory cells ofother strings of memory cells of the block of memory cells. The firstportion typically involves applying a voltage (e.g., Vcc or other supplyvoltage) to at least those data lines to be inhibited from programming(e.g., unselected data lines) while those data lines are connected totheir respective channel regions (e.g., unselected channel regions)through the activation of the drain select gates and all memory cellsassociated with those channel regions. The second portion typicallyinvolves electrically floating those unselected channel regions, andthen increasing the access line voltages to a pass voltage (e.g., Vpass)in order to boost the voltage level of the unselected channel regions.The voltage level of the pass voltage might be selected to reach aboosted voltage level of the unselected channel regions at a levelsufficient to inhibit programming of any corresponding memory cellreceiving a programming voltage in the third portion of the programmingoperation.

Consider the portion of the array of memory cells 200C of FIG. 2C, wherethe memory cell formed at the intersection of the access line 202 ₃ andthe channel region 238 ₀₀ is selected for programming, but remainingmemory cells are to be inhibited from programming. In this example, theaccess line 202 ₃ would be a selected access line, e.g., an access lineselected for programming, while access lines 202 ₀-202 ₂ and 202 ₄-202 ₇would be unselected access lines, e.g., access lines unselected forprogramming. Similarly, in this example, the data line (e.g., bit line)204 ₀ would be a selected data line while the data line (e.g., bit line)204 ₁ would be an unselected, or inhibited, data line. Because theselect line 215 ₀ may be used to selectively connect the data line 204 ₀to the memory cell selected for programming, it may be referred to as aselected select line even though it also may be used to selectivelyconnect the data line 204 ₁ to a memory cell formed at the intersectionof the access line 202 ₃ and the channel region 238 ₁₀.

In FIG. 3 , the waveform 332 represents the waveform of voltage levelsof the selected access line (e.g., access line 202 ₃) during aprogramming operation while the waveform 334 represents the waveform ofvoltage levels of an unselected access line (e.g., all or a subset ofunselected access lines 202 ₀-202 ₂ and 202 ₄-202 ₇) during theprogramming operation.

The waveform 336 represents the waveform of voltage levels of a selectedselect line (e.g., drain select line SGD or select line 215 ₀ of FIG.2C) during the programming operation, while the waveform 338 representsthe waveform of voltage levels of an unselected select line (e.g., drainselect line SGD or select line 215 ₁ of FIG. 2C) during the programmingoperation. The waveform 336 might represent voltage levels applied toselect gates 212 through the select line 215 of FIG. 2A (e.g., selectline 215 ₀ of FIG. 2C). The waveform 338 might represent voltage levelsapplied to corresponding select gates 212 through other select lines(e.g., select line 215 ₁ of FIG. 2C).

The waveform 340 represents the waveform of voltage levels of a selectline (e.g., source select line SGS or select line 214 of FIG. 2C). Thewaveform 340 might represent voltage levels applied to select gates 210of FIG. 2A. The waveform 342 represents the waveform of a source (e.g.,common source or SRC 216).

The waveform 344 represents the waveform of voltage levels of a selecteddata line (e.g., bit line) during the programming operation while thewaveform 346 represents the waveform of voltage levels of an unselecteddata line (e.g., bit line) during the programming operation. Thewaveforms 344 and 346 might represent voltage levels applied to the datalines 204 ₀ and 204 ₁ of FIG. 2C, respectively. In the followingdescription of FIG. 3 , reference numerals in parentheses refer to thecorresponding waveform for relevant voltage levels.

In the related art programming operation, at time t0, a voltage level350 might be applied (e.g., biased) to the selected access line (332)and to the unselected access line (334). A voltage level 352 might beapplied to the selected (drain) select line (336), to the unselected(drain) select line (338), and to the (source) select line (340). Avoltage level 354 might be applied to the source (342). And a voltagelevel 356 might be applied to the selected data line (344) and to theunselected data line (346). The applied voltage levels might begin fromsome initial voltage level, e.g., a reference potential. The referencepotential might be a supply voltage, e.g., Vss or ground (e.g., 0V).

Typically, the voltage level 350, e.g., a seed voltage level, might beless than the voltage level 356 of the data lines (344/346). As oneexample, the voltage level 356 applied to the data lines (344/346) mightbe a supply voltage, e.g., a positive supply voltage or Vcc, that isdifferent than (e.g., higher than) the voltage level of the referencepotential. The voltage level 352 applied to the select lines(336/338/340) might be higher than the voltage level 356 in order toactivate the corresponding select gates. The voltage level 354 appliedto the source (342) might also be higher than the voltage level 350, andmight be a same voltage level as the voltage level 356.

At time t1, the voltage level applied to the select lines (336/338/340)might be returned to the reference potential or other voltage levelsufficient to deactivate the corresponding select gates. Voltage levelsapplied to the access lines (332/334), the source (342) and the datalines (344/346) might be maintained at their voltage levels 350, 354 and356, respectively. The period of time from t0 to t1 might be referred toas a seed time or tSEED. During this period of time, a voltage level ofchannels of the memory cells might be expected to rise.

At time t2, the voltage level applied to the selected data line (344)might be lowered (e.g., biased) from the voltage level 356. For example,the voltage level applied to the selected data line (344) might betransitioned to the reference potential. The voltage level applied tothe unselected data lines (346) might be maintained at the voltage level356. Although the voltage level applied to the unselected data lines(346) might be maintained at the voltage level 356, a temporary dip inits voltage level might be expected due to capacitive coupling to theselected data line (344). The period of time from t1 to t2 might bereferred to as a discharge time or tSGDdisc.

At time t3, the voltage level of the selected (drain) select line (336)might be raised (e.g., biased) to the voltage level 358. The voltagelevel 358 may be sufficient to activate its corresponding select gateassociated with the selected data line, and to deactivate itscorresponding select gates associated with an unselected data line. Theperiod of time from t2 to t3 might be referred to as a data line (e.g.,bit line) set time or tBLSET. During this period of time, the voltagelevels of the data lines (344/346) are allowed to settle to theirintended voltage levels.

At time t4, the voltage level of the access lines (332/334) might beraised to some voltage level 360. The voltage level 360 may besufficient to activate their corresponding memory cells regardless oftheir data states, e.g., Vpass. Because the channel regions of thestrings of series-connected memory cells selectively connected to theunselected data lines are isolated from their respective unselected datalines (and, for example, isolated from the source), the higher voltagelevel of the access lines (332/334) may tend to further increase (e.g.,boost) the voltage level of these channel regions. The channel region ofthe string of series-connected memory cells selectively connected to theselected data line, being connected to the selected data line, may notexperience a change in its voltage level.

At time t5, the voltage level of the selected access line (334) might beraised to some voltage level 362. The voltage level 362 may besufficient to change (e.g., increase) a threshold voltage of a memorycell coupled to the selected access line of the string ofseries-connected memory cells selectively connected (e.g., connected) tothe selected data line, and may be configured to inhibit a change (e.g.,inhibit an increase) in a threshold voltage of any memory cell coupledto the selected access line of a string of series-connected memory cellsselectively connected to (e.g., isolated from) an unselected data line.

At time t6, the programming operation might be complete, and the variousvoltage levels could be discharged. As is typical, a verify operationmight follow to determine if any memory cells selected for programmingreached their intended target data state (e.g., target thresholdvoltage). For such memory cells reaching their intended target datastate, they might be inhibited from programming for a subsequentprogramming operation, while other such memory cells not reaching theirintended target data state might be selected for programming for asubsequent programming operation.

While the foregoing method of FIG. 3 has been used in the related art,it may be ineffective in vertical memory arrays such as the structuredepicted in FIG. 2C. In particular, as the length of the strings ofseries-connected memory cells increases, e.g., as the strings containmore memory cells, the length of the channel regions may become longer.The resulting resistance of the channel region may limit theeffectiveness of the seed operation, and thus limit the voltage levelthat might be reached during the seed portion. To mitigate such aresistance concern, various embodiments seek to employ gate-induceddrain leakage (GIDL) during seeding.

FIG. 4 depicts a waveform for a programming operation in accordance withan embodiment. The discussion of FIG. 4 will make the same references tothe structure of FIG. 2C as was used in the discussion of FIG. 3 .

In FIG. 4 , the waveform 432 represents the waveform of voltage levelsof the selected access line (e.g., access line 202 ₃) during aprogramming operation while the waveform 434 represents the waveform ofvoltage levels of an unselected access line (e.g., all or a subset ofunselected access lines 202 ₀-202 ₂ and 202 ₄-202 ₇) during theprogramming operation.

The waveform 436 represents the waveform of voltage levels of a selectedselect line (e.g., drain select line SGD or select line 215 ₀ of FIG.2C) during the programming operation, while the waveform 438 representsthe waveform of voltage levels of an unselected select line (e.g., drainselect line SGD or select line 215 ₁ of FIG. 2C) during the programmingoperation. The waveform 436 might represent voltage levels applied toselect gates 212 through the select line 215 of FIG. 2A (e.g., selectline 215 ₀ of FIG. 2C). The waveform 438 might represent voltage levelsapplied to corresponding select gates 212 through other select lines(e.g., select line 215 ₁ of FIG. 2C). The waveforms 436, 438 and 440might also represent waveforms of voltage levels applied to thecorresponding select gates of the various select lines.

The waveform 440 represents the waveform of voltage levels of a selectline (e.g., source select line SGS or select line 214 of FIG. 2C). Thewaveform 440 might represent voltage levels applied to select gates 210of FIG. 2A. The waveform 442 represents the waveform of a source (e.g.,common source or SRC 216).

The waveform 444 represents the waveform of voltage levels of a selecteddata line (e.g., bit line) during the programming operation while thewaveform 446 represents the waveform of voltage levels of an unselecteddata line (e.g., bit line) during the programming operation. Thewaveforms 444 and 446 might represent voltage levels applied to the datalines 204 ₀ and 204 ₁ of FIG. 2C, respectively. In the followingdescription of FIG. 4 , reference numerals in parentheses refer to thecorresponding waveform for relevant voltage levels.

Unlike the related art method of FIG. 3 , select gates (e.g., selectgates 210 and 212 of FIG. 2A) might remain deactivated (e.g., at areference potential) when voltage levels are raised on the data lines,and the voltage levels of the access lines (e.g., access lines 202)might remain at a reference potential. For example, at time t0, avoltage level 450 might be applied to the source (442), and a voltagelevel 452 might be applied to the selected data line (444) and to theunselected data line (446). The applied voltage levels might begin fromsome initial voltage level, e.g., a reference potential. The referencepotential might be a supply voltage, e.g., Vss or ground (e.g., 0V).

As one example, the voltage level 452 applied to the data lines(444/446) might be a supply voltage, e.g., Vcc, that is different than(e.g., higher than) the voltage level of the reference potential. Thevoltage level 450 applied to the source (442) might also be higher thanthe reference potential, and might be a same voltage level as thevoltage level 452. The voltage level 450 and/or the voltage level 452might be some voltage level sufficient to induce GIDL across the selectgates 210 and/or 212, respectively. It is not uncommon for a channelregion (e.g., channel region 338 of FIG. 2C) to have a negative voltagelevel following a read operation, such as a verify operation. Thisnegative voltage level might be on the order of a few volts. Theresulting reverse bias across the outer junction of the select gates maybe used to generate GIDL current. The negative voltage level of thechannel regions may offer lower resistance to hole transport, allowingthe GIDL current to facilitate neutralizing the voltage level of thechannel regions.

At time t1, the voltage level applied to the selected data line (444)might be lowered (e.g., biased) from the voltage level 452. For example,the voltage level applied to the selected data line (444) might betransitioned to the reference potential. The voltage level applied tothe unselected data lines (446) might be maintained at the voltage level452. Although the voltage level applied to the unselected data lines(446) might be maintained at the voltage level 452, a temporary dip inits voltage level might be expected due to capacitive coupling to theselected data line (444). The period of time from t0 to t1 might bereferred to as a seed time or tSEED. During this period of time, avoltage level of channels of the memory cells might be expected to risedue to the GIDL current, and may reach a neutral (e.g., 0V) or positivevoltage level. Note there is no corresponding discharge time (e.g.,tSGDdisc) as found in the process of FIG. 3 , which can result in timesavings over the related art.

At time t2, the voltage level of the selected (drain) select line (436)might be raised (e.g., biased) to the voltage level 454. The voltagelevel 454 may be sufficient to activate its corresponding select gateassociated with the selected data line, and to deactivate itscorresponding select gates associated with an unselected data line. Theperiod of time from t1 to t2 might be referred to as a data line (e.g.,bit line) set time or tBLSET. During this period of time, the voltagelevels of the data lines (444/446) are allowed to settle to theirintended voltage levels.

At time t3, the voltage level of the access lines (432/444) might beraised to some voltage level 456. The voltage level 456 may besufficient to activate their corresponding memory cells regardless oftheir data states, e.g., Vpass. Because the channel regions of thestrings of series-connected memory cells selectively connected to theunselected data lines are isolated from their respective unselected datalines (and, for example, isolated from the source), the higher voltagelevel of the access lines (432/444) may tend to further increase (e.g.,boost) the voltage level of these channel regions. The channel region ofthe string of series-connected memory cells selectively connected to theselected data line, being connected to the selected data line, may notexperience a change in its voltage level. Note that where the voltagelevel 456 and the voltage level 360 are a same voltage level, and wherethe voltage level of the access lines (432/434) is raised from areference potential to the voltage level 456, a larger boost of thevoltage level of the channel region might be achieved over the processof the related art of FIG. 3 where the voltage level of the access lines(332/334) is raised from the voltage level 350 to the voltage level 360.That is, a greater voltage different for boosting might be achievedusing a same final voltage for the unselected access lines.

At time t4, the voltage level of the selected access line (444) might beraised to some voltage level 458. The voltage level 458 may besufficient to change (e.g., increase) a threshold voltage of a memorycell coupled to the selected access line of the string ofseries-connected memory cells selectively connected (e.g., connected) tothe selected data line, and may be configured to inhibit a change (e.g.,inhibit an increase) in a threshold voltage of any memory cell coupledto the selected access line of a string of series-connected memory cellsselectively connected to (e.g., isolated from) an unselected data line.

At time t5, the programming operation might be complete, and the variousvoltage levels could be discharged. As is typical, a verify operationmight follow to determine if any memory cells selected for programmingreached their intended target data state (e.g., target thresholdvoltage). For such memory cells reaching their intended target datastate, they might be inhibited from programming for a subsequentprogramming operation, while other such memory cells not reaching theirintended target data state might be selected for programming for asubsequent programming operation.

FIG. 5 is a flowchart of a method of operating a memory according to anembodiment. At 571, a first voltage level might be applied to each dataline of a plurality of data lines while a second voltage level, lowerthan the first voltage level, might be applied to each select gate of aplurality of select gates. The select gates of the plurality of selectgates may each be connected between a respective data line of theplurality of data lines and a respective string of series-connectedmemory cells of a plurality of strings of series-connected memory cells.Concurrently, the first voltage level might be applied to a source andthe second voltage level might be applied to each select gate of adifferent plurality of select gates. The select gates of the differentplurality of select gates may each be connected between the source and arespective string of series-connected memory cells of a plurality ofstrings of series-connected memory cells. With reference to the exampleof FIG. 4 , the first voltage level might correspond to the voltagelevel 452 and the second voltage level might correspond to a voltagelevel lower than the voltage level 452 (e.g., the reference potential)with reference to the discussion of the period of time between t0 andt1.

At 573, a third voltage level, lower than the first voltage level, mightbe applied to a particular (e.g., selected) data line of the pluralityof data lines while continuing to apply the first voltage level to adifferent (e.g., unselected) data line of the plurality of data lines,and while continuing to apply a voltage level lower than the firstvoltage level (e.g., the second voltage level) to each gate of theplurality of select gates. Optionally, a voltage level lower than thefirst voltage level (e.g., the second voltage level) might continue tobe applied to each select gate of the different plurality of selectgates. With reference to the example of FIG. 4 , the third voltage levelmight correspond to a voltage level lower than the voltage level 452(e.g., the reference potential) with reference to the discussion of theperiod of time between t1 and t2.

At 575, a fourth voltage level, higher than the third voltage level,might be applied to a particular (e.g., selected) select gate of theplurality of select gates connected between the particular data line anda particular string of series-connected memory cells (e.g., containingthe memory cell selected for programming) of the plurality of strings ofseries-connected memory cells while continuing to apply a voltage levellower than the first voltage level (e.g., the second voltage level) to adifferent (e.g., unselected) select gate of the plurality of selectgates connected between the different data line and a different stringof series-connected memory cells (e.g., not containing a memory cellselected for programming) of the plurality of strings ofseries-connected memory cells. Optionally, a voltage level lower thanthe first voltage level (e.g., the second voltage level) might continueto be applied to select gates of the different plurality of selectgates. With reference to the example of FIG. 4 , the fourth voltagelevel might correspond to the voltage level 454 with reference to thediscussion of the period of time between t2 and t3.

At 577, a fifth voltage level, higher than the first voltage level,might be applied to each access line of a plurality of access lineswhile continuing to apply a voltage level higher than the third voltagelevel (e.g., the fourth voltage level) to the particular select gate andwhile continuing to apply a voltage level lower than the first voltagelevel (e.g., the second voltage level) to the different select gate.Optionally, a voltage level lower than the first voltage level (e.g.,the second voltage level) might continue to be applied to select gatesof the different plurality of select gates. With reference to theexample of FIG. 4 , the fifth voltage level might correspond to thevoltage level 456 with reference to the discussion of the period of timebetween t3 and t4.

At 579, a sixth voltage level, higher than the fifth voltage level,might be applied to a particular (e.g., selected) access line of theplurality of access lines while continuing to apply the fifth voltagelevel to a different (e.g., unselected) access line of the plurality ofaccess lines. With reference to the example of FIG. 4 , the sixthvoltage level might correspond to the voltage level 458 with referenceto the discussion of the period of time between t4 and t5.

FIG. 6 is a flowchart of a method of operating a memory according toanother embodiment. At 681, a first voltage level might be applied to afirst (e.g., selected) data line and a second (e.g., unselected) dataline while a second voltage level, lower than the first voltage level,might be applied to a first (e.g., selected) select gate connectedbetween the first data line and a first string of series-connectedmemory cells and to a second (e.g., unselected) select gate connectedbetween the second data line and a second string of series-connectedmemory cells. Concurrently, the first voltage level might be applied toa source and the second voltage level might be applied to a third selectgate connected between the source and the first string ofseries-connected memory cells and to a fourth select gate connectedbetween the source and the second string of series-connected memorycells. The first string of series-connected memory cells might contain amemory cell selected for programming during a programming operationwhile the second string of series-connected memory cells might notcontain a memory cell selected for programming during the programmingoperation. With reference to the example of FIG. 4 , the first voltagelevel might correspond to the voltage level 452 and the second voltagelevel might correspond to a voltage level lower than the voltage level452 (e.g., the reference potential) with reference to the discussion ofthe period of time between t0 and t1.

At 683, a third voltage level, lower than the first voltage level, mightbe applied to the first data line while continuing to apply the firstvoltage level to the second data line, and while continuing to apply thesecond voltage level to the first select gate and to the second selectgate. Optionally, the second voltage level might continue to be appliedto the third select gate and to the fourth select gate. With referenceto the example of FIG. 4 , the third voltage level might correspond to avoltage level lower than the voltage level 452 (e.g., the referencepotential) with reference to the discussion of the period of timebetween t1 and t2.

At 685, a fourth voltage level, higher than the third voltage level,might be applied to the first select gate while continuing to apply thesecond voltage level to the second select gate. Optionally, the secondvoltage level might continue to be applied to the third select gate andto the fourth select gate. With reference to the example of FIG. 4 , thefourth voltage level might correspond to the voltage level 454 withreference to the discussion of the period of time between t2 and t3.

At 687, a fifth voltage level, higher than the first voltage level,might be applied to a first (e.g., selected) access line and to a second(e.g., unselected) access line while continuing to apply the fourthvoltage level to the first select gate and while continuing to apply thesecond voltage level to the second select gate. Optionally, the secondvoltage level might continue to be applied to the third select gate andto the fourth select gate. With reference to the example of FIG. 4 , thefifth voltage level might correspond to the voltage level 456 withreference to the discussion of the period of time between t3 and t4.

At 689, a sixth voltage level, higher than the fifth voltage level,might be applied to the first access line while continuing to apply thefifth voltage level to the second access line. With reference to theexample of FIG. 4 , the sixth voltage level might correspond to thevoltage level 458 with reference to the discussion of the period of timebetween t4 and t5.

CONCLUSION

Although specific embodiments have been illustrated and describedherein, it will be appreciated by those of ordinary skill in the artthat any arrangement that is calculated to achieve the same purpose maybe substituted for the specific embodiments shown. Many adaptations ofthe embodiments will be apparent to those of ordinary skill in the art.Accordingly, this application is intended to cover any adaptations orvariations of the embodiments.

1.-20. (canceled)
 21. A memory, comprising: an array of memory cells;and a controller; wherein, during a programming operation on the arrayof memory cells, the controller is configured to: apply a first voltagelevel to a data line selectively connected to a memory cell of the arrayof memory cells; apply a second voltage level, lower than the firstvoltage level, to a control gate of a select gate connected between thedata line and the memory cell; apply a third voltage level, lower thanthe first voltage level, to the data line; apply a fourth voltage level,higher than the third voltage level, to the control gate of the selectgate; and apply a fifth voltage level to a control gate of the memorycell to program the memory cell.
 22. The memory of claim 21, wherein thecontroller is configured to apply the second voltage level to thecontrol gate of the select gate to deactivate the select gate while thefirst voltage level is applied to the data line.
 23. The memory of claim21, wherein the controller is configured to apply the fourth voltagelevel to the control gate of the select gate to activate the select gatewhile the third voltage level is applied to the data line.
 24. Thememory of claim 21, wherein the third voltage level is substantiallyequal to the second voltage level.
 25. The memory of claim 21, whereinthe second voltage level is configured to deactivate the select gatewhile the first voltage level is applied to the data line, and whereinthe fourth voltage level is configured to activate the select gate whilethe third voltage level is applied to the data line.
 26. The memory ofclaim 21, wherein the first voltage level comprises a positive supplyvoltage and the second voltage level comprises a reference potential.27. The memory of claim 21, wherein the controller is configured toapply the fifth voltage level to the control gate of the memory cellafter the fourth voltage level is applied to the control gate of theselect gate.
 28. A memory, comprising: an array of memory cellscomprising a number of strings of series-connected memory cells; and acontroller configured to: apply a first voltage level to a data lineselectively connected to a string of series-connected memory cells ofthe number of strings of series-connected memory cells, the string ofseries-connected memory cells including a memory cell; apply a secondvoltage level to a control gate of a select gate connected between thedata line and the string of series-connected memory cells, the secondvoltage level less than the first voltage level; apply a third voltagelevel to the data line, the third voltage level greater than the firstvoltage level; apply a fourth voltage level to the control gate of theselect gate, the fourth voltage level greater than the third voltagelevel; and apply a programming voltage to a control gate of the memorycell.
 29. The memory of claim 28, wherein the controller is configuredto: apply the second voltage level to the control gate of the selectgate to deactivate the select gate while the first voltage level isapplied to the data line; and apply the fourth voltage level to thecontrol gate of the select gate to activate the select gate while thethird voltage level is applied to the data line.
 30. The memory of claim28, wherein the second voltage level and the third voltage level areeach a reference potential of the memory.
 31. The memory of claim 28,wherein the controller is further configured to: apply the first voltagelevel to a second data line selectively connected to a second string ofseries-connected memory cells of the number of strings ofseries-connected memory cells, the second string of series-connectedmemory cells including a second memory cell; apply the second voltagelevel to a control gate of a second select gate connected between thesecond data line and the second string of series-connected memory cells;and apply the fourth voltage level to the control gate of the secondselect gate.
 32. The memory of claim 31, wherein the controller isconfigured to decrease a voltage level applied to the data line from thefirst voltage level to the third voltage level while continuing to applythe second voltage level to the control gate of the select gate.
 33. Thememory of claim 28, wherein the combination of the first voltage levelapplied to the data line and the second voltage level applied to thecontrol gate of the select gate induces gate-induced drain leakage(GIDL) current from the data line to the string of series-connectedmemory cells through the select gate.
 34. The memory of claim 28,wherein the controller is configured to apply the first voltage level toa plurality of data lines including the data line while the secondvoltage level is applied to a plurality of select gates including theselect gate.
 35. A method of operating a memory, comprising: applying afirst voltage level to a data line selectively connected to a memorycell of an array of memory cells; applying a second voltage level to acontrol gate of a select gate connected between the data line and thememory cell; decreasing a voltage level applied to the data line fromthe first voltage level to a third voltage level; increasing a voltagelevel applied to the control gate of the select gate from the secondvoltage level to a fourth voltage level, higher than the third voltagelevel; and applying a programming voltage to a control gate of thememory cell.
 36. The method of claim 35, wherein applying the thirdvoltage level comprises applying the third voltage level having the samevoltage level as the second voltage level.
 37. The method of claim 35,wherein applying the second voltage level comprises applying the secondvoltage level, being lower than the first voltage level, to the controlgate of the select gate.
 38. The method of claim 35, wherein applyingthe second voltage level to the control gate of the select gatecomprises deactivating the select gate while the first voltage level isapplied to the data line.
 39. The method of claim 35, wherein applyingthe fourth voltage level to the control gate of the select gatecomprises activating the select gate while the third voltage level isapplied to the data line.
 40. The method of claim 35, wherein applyingthe third voltage level comprises applying the third voltage levelhaving substantially the same voltage level as the second voltage level.